1 Extract gas.
Continuously extract air, water vapor, process gases, etc. from sealed containers through mechanical or physicochemical means such as volume changes, momentum transfer, gas adsorption, etc.
2 Establish a vacuum gradient.
Realize different pressure levels from coarse vacuum (1000~1 mbar) to ultra-high vacuum (<10 ⁻⁹ mbar) to meet the needs of multiple scenarios.
3 Maintain pressure stability.
In dynamic processes such as coating and drying, to counteract gas leakage or deflation effects, maintain a stable set vacuum degree (fluctuation<± 1%).
Application effect:
1. Food packaging: inhibits microbial growth and extends shelf life by 3-5 times.
2. Freeze drying: The drying time of drugs is reduced by 40%, and the retention rate of active ingredients is>98%.
3. Dairy concentration: Vacuum evaporation efficiency is 5 times higher than atmospheric pressure, and energy consumption is reduced by 60%.
4. Plant essential oil extraction: 40 ℃ low-temperature vacuum distillation, with zero damage to thermosensitive components.
5. Carbon fiber solidification: Vacuum bag pressure eliminates bubbles, porosity<0.5%.
6. Resin infusion: Vacuum guided resin flow, fiber infiltration degree>99%.
7. Lithium battery injection: eliminates bubbles and improves ion conductivity efficiency.
8. Degassing of molten steel: The hydrogen content of molten steel should be ≤ 1.5ppm to avoid brittle cracking.
9. Vacuum metallurgy: Smelting in an oxygen free environment, titanium alloy oxygen impurities<0.01%, strength increased by 20%.
10. Semiconductor coating: Under a vacuum of 10 ⁻⁶ mbar, the plasma diffuses uniformly, and the film thickness error is ≤± 2%.
11. Tool coating: Vacuum nitriding (520 ℃), hardness up to HV2300, life extended by 8 times.
12. Printing film coating: Vacuum adsorption flattens the substrate, eliminates bubbles and wrinkles, and reduces the defect rate from 5% to 0.3%.
13. Particle accelerator: Ultra high vacuum (10 ⁻¹⁰ mbar) reduces gas molecule collisions and ensures stable transmission of particle beams.
14. Plasma etching: Control the partial pressure of the reaction gas to accurately etch nanoscale circuits (with an error of<5nm).
Vacuum pumps have become the process empowerment core of high-end manufacturing, creating a "negative pressure ecology" that continues to drive industrial upgrading and technological revolution, from micrometer level chips to hundred meter level wind turbine blades.